Home > Copper Clad Laminates > Wangling F4BM233 DK2.33 Df0.0011 (0.1-12.0mm) PTFE Glass Fabric Copper Clad Laminate

Wangling F4BM233 PTFE Glass Fabric Copper Clad Laminate
Material:Wangling F4BM233 / PTFE + Fiberglass with ED Copper
MOQ:1 Sheet
Price:169-699 USD/Sheet
Packaging:Anti-static / Protective Packaging
Delivery Period:5-11 working days
Payment Method:T/T, Paypal
 

Wangling F4BM233 DK2.33 Df0.0011 (0.1-12.0mm) PTFE Glass Fabric Copper Clad Laminate


Brief Introduction

Wangling F4BM series are PTFE glass fabric copper-clad laminates made from PTFE resin, PTFE film, and woven glass fabric. They offer improved electrical performance over standard F4B, including a wider dielectric constant range, lower loss, higher insulation resistance, and better stability, making them a suitable substitute for similar international products. F4BM233 uses standard ED copper foil and is ideal for applications without PIM requirements.


Technical Features & Benefits

Selectable Dielectric Constant (Dk) from 2.17 to 3.0; customizable Dk available.
Low dissipation factor (low loss).
Good dimensional stability and enhanced size control.
Radiation resistance and low outgassing.
Commercial, high-volume, cost-effective production.
UL 94 V-0 flammability rating.


Wangling F4BM233 Laminate


Typical Properties: F4BM233

Properties Test Conditions Unit F4BM233
Electrical Properties
Dielectric Constant (Typical)10 GHz-2.33
Dielectric Constant Tolerance/-±0.04
Dissipation Factor (Typical)10 GHz-0.0011
20 GHz-0.0015
Temperature Coefficient of Dk-55°C to 150°Cppm/°C-130
Peel Strength1 oz. F4BMN/mm>1.8
Volume ResistivityNormal ConditionMΩ·cm≥6×10⁶
Surface ResistanceNormal Condition≥1×10⁶
Dielectric Strength (Z-direction)5 kW, 500 V/skV/mm>23
Breakdown Voltage (XY-direction)5 kW, 500 V/skV>32
Thermal & Mechanical Properties
CTEXY-direction, -55°C to 288°Cppm/°C22~30
Z-direction, -55°C to 288°Cppm/°C205
Thermal Stress260°C, 10s, 3 cycles-No Delamination
Water Absorption20±2°C, 24 hours%≤0.08
DensityRoom Temperatureg/cm³2.20
Long-term Operating TemperatureHigh/Low Temp Chamber°C-55 to +260
Thermal ConductivityZ-directionW/(m·K)0.28
Flammability Rating/UL-94V-0
Material Composition//PTFE, Glass Fiber Cloth; F4BM uses ED copper foil.

Application Areas

Microwave, RF, Radar
Phase Shifters, Passive Components
Power Dividers, Couplers, Combiners
Feed Networks, Phased Array Antennas
Satellite Communication, Base Station Antennas


Available Configurations

Copper Foil Options for F4BM: ED Copper Foil. Available thicknesses: 0.5 oz (0.018mm), 1 oz (0.035mm), 1.5 oz (0.05mm), 2 oz (0.07mm).

Standard Panel Sizes Available:
460 × 610 mm
500 × 600 mm
850 × 1200 mm
914 × 1220 mm
1000 × 1200 mm

Available Thicknesses & Tolerances (Conventional):
Thickness (mm): 0.1 (core), 0.127 (core), 0.2, 0.25, 0.5, 0.508, 0.762, 0.8, 1.0, 1.5, 1.524, 1.575, 2.0, 2.5, 3.0, 4.0, 5.0, 6.0, 8.0, 10.0, 12.0.
Corresponding tolerances range from ±0.01mm to ±0.20mm.
Note: For Dk ≤ 2.65, minimum core thickness is 0.1mm. For Dk 2.7–3.0, minimum core thickness is 0.2mm.

F4BM Series with Metal Core (Aluminum/Copper Base):
Models: F4BM*-AL (Aluminum base), F4BM*-CU (Copper base).
Serves for shielding or heat dissipation.
Example: F4BM233-AL represents F4BM233 with an aluminum base.
Standard sizes available: 460×610 mm, 460×305 mm. Other sizes upon request.


 

Get a Quick Quote

Fill in the form below and our engineers will reply within 24 hours with technical specifications and pricing for Wangling F4BM233 PTFE Glass Fabric Copper Clad Laminate.

No file chosen

Max 10MB/file: .zip, .pdf, .jpg, .png, .txt (multiple)

Your information is safe. We'll respond within 24 hours.

Previous Rogers CuClad 233 DK2.33 Df0.0013 (Various Thickness) PTFE PCB Board Material

Next Wangling F4BME233 DK2.33 Df0.0011 (0.1-12.0mm) RTF Copper Clad Laminate